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ATTEN AT-8235 BGA REWORK SYSTEM(SP-392)

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Product ID :SP-392

This product is designed with HD touch screen, controlled with IPC, CPU and equipped with instant curve analysis function. This device can display real settings, measured ...

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Details

This product is designed with HD touch screen, controlled with IPC, CPU and equipped with instant curve analysis function. This device can display real settings, measured temperature curve and correct curves.
Designed with high precision K-type thermocouple and automatically temperature offset system, which is combined with temperature controlling module and PLC to control temperature accurately with difference in 2℃.
This product is equipped with high accuracy digital image recognition system in which PCB board can be positioned fast, accurately and conveniently on slide along X,Y,Z axis which meets the requirements of various PCB board layouts and positioning.
Flexible and mobile universal clamp can protect PCB, avoid damage to PCB edge component, avoid distortion to PCB and suitable for BGA reworking of various size.
All 3 heating area can be heated up separately and controlled with multiple sets or grades temperatures simultaneously to obtain best soldering effect. All configurations for heating temperature, heating time, slope and cooling can be completed on display screen.
Equipped with various alloy nozzles which could be rotated for 360° to be convenient for installation and replacement.
Six grades temperature control for upside and downside heating area, which can be extended to eight grades.
Massive curves can be stored which also can be called for different BGA, be analyzed, configured and modified on touch screen. ALL 3 heating areas are controlled by PID algorithm independently.
More stable heating and more accurate temperatures.
High power and high flow fan is used to cool PCB for avoiding distortion. All packaging, soldering and DE soldering process is executed automatically and intelligently.
USB port for USB flash driver to download curves and for mouse to extend touch screen lifespan.
Alarming function as DE soldering or soldering work completed to prompt operator ready for next step. At the same time, automatic or manual enabled high, horizontal airflow fan will be used to cool PCB down before its distortion.
Approved by CE certification and equipped with sudden-stop switch and automatic cutout for emergency.
TECHNICAL SPECIFICATIONS
Total Power: 4800W
Top heater: 800W
Bottom heater: 1200W (2nd heater at bottom); 2800W (3rd IR heater at bottom)
Power: AC220V±10% 50/60Hz
Dimensions: L580×W560×H560 mm
Temperature control: V-groove, PCB support can be adjusted in any X, Y direction with external fixture
Temperature control method: K Sensor, Closed loop
Temp accuracy: ±2°c
PCB size: Max 500×450 mm Min 22×22 mm
BGA chip: 2*2mm min; 80*80mm max
Minimum chip spacing: 0.15mm
External Temperature Sensor: 1 optional
Net weight: 40kg

 

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Warranty Terms

All products will carry manufacturer warranty, any damage caused by misuse or physical damage will not be covered under warranty. The warranty periods vary according to different products, and for details please speak to our office. Any claims for missing items from shipment must reported with in 24 hours of receiving the shipment and claims after that will not be entertained..
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